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ST115G PCB

ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.

High Thermal Conductivity PCB

The high thermal conductivity FR4 circuit board usually guides the thermal coefficient to be greater than or equal to 1.2, while the thermal conductivity of ST115D reaches 1.5, the performance is good, and the price is moderate. The following is about High Thermal Conductivity PCB related, I hope to help you better understand High Thermal Conductivity PCB.

High TG PCB

In 1961, Hazelting Corp. of the United States published Multiplanar, which was the first pioneer in the development of multilayer boards. This method is almost the same as the method of manufacturing multilayer boards by using the through-hole method. After Japan stepped into this field in 1963, various ideas and manufacturing methods related to multi-layer boards were gradually spread all over the world. The following is about 14 Layer High TG PCB related, I hope to help you better understand 14 Layer High TG PCB.

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ST115G PCB

High Thermal Conductivity PCB

High TG PCB