copper paste filled hole PCB: Bai AE3030 copper pulp is a non-conductive DAO copper paste used for the high-density assembly of printed substrate DU plate and the laying of wires.Due to the characteristics of Zhuan "high Thermal conductivity", "bubble-free", "flat" and so on, the copper paste is most suitable for the design of high reliability Pad on Via, stack on Via and Thermal Via. The copper paste is widely used from aerospace satellite, server, cabling machine, LED backlight and so on.
Read MoreSend InquiryCommonly used high-speed circuit substrates include M4, N4000-13 series, TU872SLK (SP), EM828, S7439, IS I-speed, FR408, FR408HR, EM-888, TU-882, S7038, M6, R04350B, TU872SLK and other high-speed Circuit material. The following is about Megtron4 High speed PCB related, I hope to help you better understand Megtron4 High speed PCB.
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