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Home > News > Industry News

Industry News

Change of substrate size in PCB manufacturing process
Change of substrate size in PCB manufacturing process

the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

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PCB production, these matters you must pay attention to!
PCB production, these matters you must pay attention to!

People who make circuit boards know that the production process is very complex~

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PCB production, you must pay attention to these matters
PCB production, you must pay attention to these matters

Cutting, fillet, edging, baking, inner layer pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, target drilling, Gong edge, drilling, copper plating, film pressing, printing, writing, surface treatment, fin......

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What material is the chip mainly composed of
What material is the chip mainly composed of

Chip is the general term of semiconductor component products. Chip is also called integrated circuit and IC. What material is the chip mainly composed of? Let's have a look!

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